| Session 6:
Display Manufacturing: Glass Substrates &
Inspection (Display Manufacturing) |
|
Tuesday, May 20 / 10:50 - 11:50 am / Room 403A |
|
Chair: Toshiaki
Arai, Sony Corp. |
|
Co-Chair: Greg
Gibson, FAS Technologies, LLC |
|
6.1: |
A Study of the
Relationship between the Quality of the LCD Panel and the Nano-Scale
Bumps of the Substrate Glass
Kumi-Mi Oh, LG.Philips LCD, Kyunggi-do, Korea |
|
6.2: |
Mechanical Properties of
Code 2073-G Glass Substrate for Poly-Si Application
Suresh Gulati, Corning Incorporated, Corning, NY, USA |
|
6.3: |
Detection of a-Si Residue
with Backlight LEDs
Chung-Che Huang, Maxim Integrated Products, Sunnyvale, CA, USA
|
| Session 12:
Display Manufacturing: Flexible Substrates (Display
Manufacturing) |
|
Tuesday, May 20 / 2:00 - 3:10 pm / Room 403A |
|
Chair:
Elliott Schlam, Elliott Schlam Associates
|
|
Co-Chair:
Jun Hyung Souk, Samsung Electronics Co., Ltd.
|
|
12.1: |
Evaluation of Electrical
Insulating Properties and Flexibility of Stainless-Steel Foil with
Insulating Film
Noriko Yamada, Nippon Steel Corp., Chiba, Japan |
|
12.2: |
Solution-Processable
Passivation Layer for Active-Matrix TFTs on Rigid and Flexible
Substrates
Ahila Krishnamoorthy, Honeywell Electronics Materials, Sunnyvale,
CA, USA |
|
12.3: |
Fluorescent Tag-Based
Inspection of Barrier Coatings for OLEDs and Polymer Packages
Yadong Zhang, University of Colorado at Boulder, Boulder, CO, USA
|
|
12.4: |
Late-News
Paper: Measurement of Water-Vapor Permeation in the
Range of 10(-3) and 10(-5) g/m(2)/day for Application in Flexible
Electronics.
Holger Norenberg, Technolox Ltd., Oxford, UK
|
| Session 19:
Display Assembly & Packaging (Display
Manufacturing) |
|
Tuesday, May 20 / 3:40 - 5:00 pm / Room 403A |
|
Chair:
Lauren F. Palmateer, Qualcomm MEMS Technologies
|
|
Co-Chair:
Jun Hyung Souk, Samsung Electronics Co., Ltd.
|
|
19.1: |
Invited Paper:
Driver-IC
Packaging Technologies Using Anistropic Conductive Films in
Flat-Panel Displays
Itsuo Watanabe, Hitachi Chemical Co. Ltd., Ibaraki, Japan |
|
19.2: |
Invited Paper:
ACF
Development History and New Solutions
Motohide Takeichi, Sony Chemicals Corp., Tochigi, Japan |
|
19.3: |
Novel Defect-Repairing
Method for Etched-Thinning LCDs
Yu-Chen Liu, AU Optronics Corp., Hsinchu, Taiwan |
|
19.4: |
Development of Super View
Resin: The Optical Elasticity Resin for LCD Modules
Hirofumi Kondo, Sony Corp., Kanuma, Japan
|
| Session 24:
Array Manufacturing Processes (Display Manufacturing) |
|
Wednesday, May 21, 2008 / 9:00 - 10:20 am / Room 403A |
|
Chair:
Fan-Chen F. Luo, AU Optronics Corp.
|
|
Co-Chair:
Toshiaki Arai, Sony Corp.
|
|
24.1: |
Three-Mask TFT Process by
Using ITO Lift-Off Technique
Kuo Lung Fang, AU Optronics Corp., Hsinchu, Taiwan |
|
24.2: |
Single-Layer Al-Ni-La-Si
Interconnections for Source / Drain of LTPS-TFT LCDs Using Direct
Contacts with ITO and Poly-Si
Toshihiro Kugimiya, Kobelco Kaken, Inc., Hyogo, Japan |
|
24.3: |
32-in. LCD TV Using
Conventional PECVD Microcrystalline-Silicon TFTs
Ya-Hui Peng, AU Optronics Corp., Hsinchu, Taiwan |
|
24.4: |
A New Method for Cu
Patterning
Kang-il Kim, LG.Philips LCD R&D Centre, Kyunggi-do, Korea
|
| Session 31:
Display Manufacturing: Ink-Jet Printing (Display Manufacturing)
|
|
Wednesday, May 21 / 10:40 am - 12:00 pm / Room 403A |
|
Chair:
Peter A. Smith, Honeywell
|
|
Co-Chair:
Lauren F. Palmateer, Qualcomm MEMS Technologies
|
|
31.1: |
Invited Paper: Ink-Jet
Technology for Large-Sized Color-Filter Plates
Jun Hyung Souk, Samsung Electronics Co. Ltd., Kyunggi-do, Korea
|
|
31.2: |
Invited Paper: Various
Ink-Jet Methods for TFT Array Fabrication
Shuichi Uchikoga, Toshiba Corporate Research Center, Kanagawa,
Japan
|
|
31.3: |
The Fabrication of Single
Substrate Multi-Color Cholesteric LCD by Ink-Jet Printing
Jhih-Ping Lu, Industrial Technology Research Institute, Chutung,
Hsinchu, Taiwan
|
|
31.4: |
Solvent Effect on
Uniformity of the Performance of Ink-Jet-Printed Organic TFTs for
Flexible Displays
Jin Jang, Kyung Hee University, Seoul, Korea
|
| Session 37:
Innovative Display Manufacturing (Display Manufacturing)
|
|
Wednesday, May 21 / 3:30 - 4:40 pm / Room 403A
|
|
Chair:
Bennet Chu, RiTdisplay Corp.
|
|
Co-Chair:
Peter A. Smith, Honeywell
|
|
37.1: |
Novel Development of
Large-Sized Electrowetting Display
Wei-Yuan Cheng, Industrial Technology Research Institute, Hsinchu,
Taiwan
|
|
37.2: |
Field-Sequential FLCDs
Fabricated by Ink-Jet Technology
Masato Okabe, Dai Nippon Printing Co., Ltd., Chiba, Japan
|
|
37.3: |
Low-Cost Manufacturing of
Patterned Films with Nano-Precision
Zhilian Zhou, Liquidia Technologies, Inc., Durham, NC, USA
|
|
37.4: |
Late-News
Paper: Intergration of Carbon-Nanotube Transparent
Electrodes into Display Applications
Young Bae Park, Unidym Inc., Menlo Park, CA, USA
|
| Session 43:
Display Manufacturing: Printing & Coating
Processes (Display Manufacturing) |
|
Thursday, May 22 / 9:00 - 10:20 am / Room 403A |
|
Chair:
Greg Gibson, FAS Technologies, LLC
|
|
Co-Chair:
Elliott Schlam, Elliott Schlam Associates
|
|
43.1: |
Design Parameters of Roll-Printing
Process for TFT-LCD Fabrication
Youn-Gyoung Chang, LG.Philips LCD, Kyunggi-do, Korea |
|
43.2: |
Color Plastic Bistable Nematic Display
Fabricated by Imprint and Ink-Jet Technology
John Rudin, Hewlett Packard Labs, Avon, UK |
|
43.3: |
Slot-Die Coating for OLED Displays
Tami Faircloth, Dupont Displays, Inc., Santa Barbara, CA, USA |
|
43.4: |
Enhancement of Roll-Printing
Accuracy for TFT-LCDs
Seung-Hee Nam, LG.Philips LCD, Kyunggi-do, Korea
|
| Session 49:
Laser Manufacturing Processes (Display Manufacturing) |
|
Thursday, May 22 / 10:40 am - 12:00 pm / Room 403A |
|
Chair:
Lauren F. Palmateer, Qualcomm MEMS Technologies
|
|
Co-Chair:
Fan-Chen F. Luo, AU Optronics Corp.
|
|
49.1: |
Invited Paper: Laser-Induced Full-Body
Cleavage of Glass for FPDs
Kojiro Karube, LEMI, Co., Ltd., Kanagawa, Japan |
|
49.2: |
Innovative Laser Patterning of Black
Matrix for LCD Manufacture
Paul Harrison, Powerlase Ltd., Crawley, UK |
|
49.3: |
Mechanism and Advanced Application of
Rapid Laser Process on SnO2-System Thin Films for FPD Manufacture
Reo Usui, Osaka University, Osaka, Japan |
|
49.4: |
Direct-Imaging System by Using a UV
Pulse Laser and Small Variable-Aperture Masks for Color-Filter
Fabrication
Yukihide Shigeno, Dainippon Screen Mfg. Co., Ltd., Shiga, Japan
|
| Poster Session |
Thursday, May 22 / 4:00 - 7:00 pm / Exhibit Hall B
|
|
Display Manufacturing |
|
P.62: |
Organic Surface on
of a TFT Array Treated with Nitrogen Plasma
Hsin-Ming Liao, AU Optonics Corp., Hshichu, Taiwan |
|
P.63: |
A New Transparent
Plastic Substrate Having High Heat Resistance and Low Retardation
for Flexible Displays
Yasuyoshi Fujii, Tosoh Corp., Yokkaichi, Japan |
|
P.64: |
Optimum Slit Design
Simulation Applied by Gray-Tone Photolithography
Seungjin Choi, Xihuanzhonglu, BDA, Beijing, China |
|
P.65: |
Optimizing Polyester
Films for Flexible Electronic Applications
Robert Eveson, Dupont Teijin Films (UK) Limited, Middlesbrough,
UK |
|
P.66: |
Large-Area
Color-Filter Fabrication by Using Ink-Jet-Printing Technology
Siang Jhih Wu, National Chiao Tung University, Hsinchu, Taiwan |
|
P.67: |
Wet Etching of
Gallium Indium Zinc Oxide (GIZO) Semiconductor for TFT Application
Jong Hyun Seo, Hankuk Aviation University, Kyunggi-do, Korea |
|
P.68: |
Recent Development
of Anisotropic Conductive Film for Fine-Pitch COF Connection
Ryoji Kojima, Sony Chemical & Information Device Corp.,
Kanuma, Japan
|
|
P.69: |
PDP Fabricated with
Low-Temperature Processes Below 300°C Using Sol-Gel Hybrid
Polymers (Hybrimer PDP)
Byeong-Soo Bae, KAIST, Daejeon, Korea
|
|
P.70: |
Improvement of
Material Utilization of Organic Evaporation Source for
Manufacturing Large-Sized AMOLED Devices
Haewon Kim, Doosan Mecatec, Ansan, Korea
|
|
P.71: |
Substrate Adhesion
Technique Using Thermosetting Resin to Apply Roll-to-Roll Process
in the Manufacture of LCDs
Joon-Hyung Kim, Hanyang University, Seoul, Korea
|
|
P.72: |
Is the
Photoelasticity of PSAs for LCD Panels Reducible?
Kentaro Kusama, Lintec Corp., Saitama, Japan
|
|
P.73: |
Mechanical Assisted
Corrosion: An Investigation of Thin-Film Components Used in
Flexible Optoelectronic Applications
Nicholas Morris, West Virginia University, Morgantown, WV, USA
|
|
P.74: |
Low-Temperature a-Si
TFT on Soda-Lime Glass
Ya-Tang Yang, AKT, Santa Clara, CA, USA
|
|
P.75: |
Modification of RGB
Photoresists for Color Filters
Cheng-Han Chen, Tatung University, Taipei, Taiwan
|
|
P.76: |
Reflection Pattern
Printing for Light Guide Using an Ink-Jet Coating Method
Jang Hwan Hwang, Hongik University, Seoul, Korea
|
|
P.77: |
Polymer-Based
Plastic Electrode Film for PDLC Applications
Jin Yeol Kim, Kookmin University, Seoul, Korea
|
|
P.78: |
Process
Simplification for Passive-Matrix OLEDs
Seungjun Yi, Hoseo University, Chungcheongnam-do, Korea
|
|
P.79: |
Characterization of
Narrow-Channel TFT Using Asymmetric Halftone Exposure
Mungi Park, LG.Philips LCD, Kyunggi-do, Korea
|
|
P.80: |
Permeation-Rate
Measurements System and Its Application to Polymeric Substrates
Byeong-Kwon Ju, Korea University, Seoul, Korea
|
